Manufacturing Capabilities
Heller solves the challenges of productivity and versatility. The new Model 1700W demonstrates Heller's leadership in the reflow marketplace. We provide the most advanced reflow technology for your surface mount assembly line, while combining a more robust system with unmatched versatility and engineering expertise.
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Heller 1700W Reflow Oven
The 1700W- from Heller's newest generation of reflow ovens- provides 25% higher airflow for enhanced temperature uniformity, repeatability and high-load handling. The 1700W features Heller's new, enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone and oven-to-oven. It also provides more flexibility in board handling, more robust construction and a more streamlined appearance.
The 1700W supports high-speed, high-volume throughput at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.
For higher heat transfer rates, increased productivity and greater footprint, specify Heller's new Model 1700W.
Heller 1700W versatility: single or dual-rail edge hold conveyor
With a high-capacity, 26-inch-wide (66 cm) tunnel, the 1700W offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor, to carry even the largest boards or multi-board panels, up to 24 inches wide (61 cm), through the oven
To maximize flexibility, 1700W users may specify width-adjustable single edge hold conveyor or dual-rail edge hold conveyor with each side independently adjustable for width and speed.
The 1700W may also be configured with a dual-rail edge hold conveyor; each side is independently adjustable to convey boards as wide as ten inches (25.4 cm). Computer-controlled automatic adjustment of conveyor width is available as an option for both conveyor types.
The speed of each rail is also independently adjustable, allowing for two distinct temperature profiles to run simultaneously in the oven thus supporting both reflow and short-term curing. The ability to conveyor two production lines concurrently, processing any combination of board sizes and conveyor speeds, can eliminate the need and the space requirement for second oven.
The Heller 1700W: reflow advantages for every high-volume application
The Model 1700W combines sophisticated new design elements with the engineering expertise and reflow technology leadership you've come to expect from Heller:
- New, enlarged heating tunnels and baffle-free design for 25% higher airflow, enhanced temperature uniformity, repeatability and high-load handling.
- Module response of less than one second to temperature changes of less than 0.1oC, thereby maintaining profile integrity for heavy board loads.
- Single edge hold conveyor adjustable for boards as wide as 24 inches (61cm) or a dual-rail edge hold conveyor; each side is independently speed-adjustable for boards as wide as 10 inches (25.4 cm).
- Total forced convection using air or inert atmosphere, with nitrogen consumption levels as low as 850 SCFH (23.8 m3/hour) at 25 PPM.
- Available with optional UltrafLow (Patent Pending) design, to reduce nitrogen consumption to less than 350 SCHF (10m3/hour).
- Optimal thermocouple location in the air stream for fast response and accurate zone temperature control.
- Rapid profiling changes plus fast warm-up and cool-down.
- Wide process window for "universal profiling"- allows many different boards to be run on single temperature profile.
- A more streamlined appearance, with integral CPU and keyboard, plus robust, heavy-duty construction for years of reliable service.
- Auto hood lift for effortless raising of the tunnel clamshell.
- PC-driven PID closed-loop controller capable for networking into a CIM environment.
- Advanced three-thermocouple board profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.
- Resourceful engineering and flexible design to support customized solutions to unique process requirements.
- Worldwide, leading-edge support: optional RMATS (Remote Modem-Accessible Technical Support) with global video links for direct access to a factory-based Heller engineer.
- GEM/SECS II interface software is available for an optional feature.
A complete approach to reflow technology is what makes Heller the world class leader.
System Features:
- The most efficient heat transfer, from extra high-volume, high-velocity, heating modules, producing temperature gradients of less than 2oC throughout the oven.
- Instant-response heating modules that react in less than one second to temperature changes of less than 0.1oC to maintain profile integrity for heavy board loads.
- Flux filtration system removes up to 95% of flux from the atmosphere - processing boards in a flux-free environment.
- The lowest nitrogen consumption in the industry: 350 SCFH with our UltrafLOW option.
- Six-sigma reliability for the most demanding production environments.
- Single or dual-rail edge hold conveyor for greater versatility in board handling.
- User-friendly WindowsTM software.Alternate curing configuration, with topside IR panels to create a temperature differential that protects heat-sensitive components.
- An optional UV module may be added for UV cure adhesives.
Pure convection technology provides flexibility to produce any solder paste manufacturer's recommended profile.
Reduced Maintenance Features:
- Computer-controlled automatic lubrication system for "hands-off" maintenance.
- Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" maintenance with no downtime and no change in oven PPM levels. A reusable filter is an available option.
- Recirculating warm water cooling system reduced flux condensation on the heat exchanger and traps flux in the filter - extending maintenance intervals by up to 300%.