PCB Manufacturing Capabilities

Laritech currently utilizes five production lines for manufacturing PCB's. Each line is specialized for unique customer requirements. In addition to Laritech's Engineering capabilities, Laritech has grown organically to support our customer's production requirements. From PCBA to complete Box Builds whether you need a single prototype or low to high volume assembly, our state of the art equipment and seasoned staff are available to assist you.

Don't miss our printed circuit board solutions in Case Studies, offering a diversity of Laritech PCB's, programming and integration.


High Volume PCB Assembly (Line 1)

LARITECH WEST

Features:

  • 100,000 placements per hour
  • Component size from 0201- 3 1/2" BGA’s or 5" X 1/2" connectors

Line One PCB assembly equipment includes:

  • EKRA X4 Base Screen Printer
  • Koh Young 3D Paste Inspection
  • Siemens SiPlace HS-60 Very High Speed SMD Placement
  • Siemens SiPlace 80S20 High Speed SMD Placement
  • Siemens SiPlace HF-3 Hi Flex SMD Placement
  • Heller 1707 MKIII Reflow Oven
  • Koh Young 3D Automated Optical Inspection

 

High Volume PCB Assembly (Line 2)

LARITECH WEST

Features:

  • 49,000 placements per hour
  • Component Size range from 0201 to 2" BGA's

Line Two PCB assembly equipment includes:

  • MPM Ultraprint 2000
  • Koh Young 3D Paste Inspection
  • Siemens SiPlace HS-60 Very High Speed SMD Placement
  • Siemens SiPlace 80S20 High Speed SMD Placement
  • Siemens SiPlace CF High Speed SMD Placement
  • Heller 1707 MKIII Reflow Oven
  • Yestech FX Series Automated Optical Inspection

 

Quick Turn PCB Assembly (Line 3)

LARITECH NORTH

Features:

  • 30,000 placements per hour
  • Component size range from 0402- 2" BGA's

Line 3 PCB Assembly equipment includes:

  • MPM Speedline Screen Printer
  • Siemens SiPlace 80S20 High Speed SMD Placement
  • Siemens SiPlace 4F High Speed SMD Placement
  • Heller 1707 MKIII Reflow Oven
  • Mirtec Automated Optical Inspection

 

Quick Turn PCB Assembly (Line 4)

LARITECH NORTH

Features:

  • 4500 placements per hour
  • Component size range from 0402-2" BGA's

Line Four PCB assembly equipment includes:

  • Manncorp 4500 Screen Printer
  • Juki Placemat 570
  • Heller 1707 MKIII Reflow Oven

 

Thru-hole PCB Assembly (Line 5)

LARITECH WEST

Line Five PCB assembly equipment includes:

  • Vitronics-Soltec Midi-Wave
  • Hakko 485 Mini Wave Leaded
  • Hakko 485 Mini Wave Lead-free
  • SeHo Selective Solder Machine
  • Various cutting and component prep machines

 

Other PCB Assembly Equipment includes:

  • BP Micro Universal Programmer
  • Creative Electron High Definition X-Ray
  • AQUA KLEAN T-12 Typhoon in-line Aqueous Cleaner

 

BGA Rework

  • Airvac Onyx 29 BGA Rework Machine
  • Various BGA inspection and reballing equipment

Laritech's new BGA advanced SMT production rework and assembly machine provides an unparalleled level of automation and process control for SMT rework and assembly.

Applications

Lead-Free, 0201, Flip Chip, Micro BGA/CSP, MEMS, Optoelectronics, Microwave, MLF's and other devices. Existing technology including BGA, CSP, Leaded Devices and Surface Mount Connectors can also be easily accommodated.

Benefits:

  • 9 micron placement accuracy (0.0003") @ 3 Sigma
  • High volume rework
  • Ultra-fast heat up for Lead-Free Rework
  • Fast, controlled board cool down
  • Process repeatability
  • Uniform joint temperature
  • Precision air flow
  • Simple, fast & easy to use software
  • Large, clear images for component alignment
  • Components up to 3.0" (75mm)
  • Micro site cleaning
  • Clean and uniform pads for replacement device
  • Solder dots or lines down to 0.010"
  • Dispensing of solder paste, epoxy, under fill or flux